ISSN 0253-2778

CN 34-1054/N

Open AccessOpen Access JUSTC

Numerical simulation of heat transfer performance of CFRP plate adhesive structure

Cite this:
https://doi.org/10.3969/j.issn.0253-2778.2019.06.008
  • Received Date: 28 November 2018
  • Rev Recd Date: 20 February 2019
  • Publish Date: 30 June 2019
  • The steady-state heat transfer characteristics of typical bonding structures such as butting and splicing in carbon fiber reinforced composite (CFRP) grille reflector were analyzed by ANSYS finite element method. The effects of epoxy resin with high thermal conductivity materials such as alumina, silicon nitride and graphene on heat transfer were compared and analyzed. The results show that with the increase in thermal conductivity of epoxy resin adhesives, the thermal resistance of the bonding interface decreases, the temperature difference of bonding site decreases, and the temperature distribution uniformity is higher, thus providing a research basis for effectively predicting the temperature distribution and thermal deformation of solid reflectors in orbit.
    The steady-state heat transfer characteristics of typical bonding structures such as butting and splicing in carbon fiber reinforced composite (CFRP) grille reflector were analyzed by ANSYS finite element method. The effects of epoxy resin with high thermal conductivity materials such as alumina, silicon nitride and graphene on heat transfer were compared and analyzed. The results show that with the increase in thermal conductivity of epoxy resin adhesives, the thermal resistance of the bonding interface decreases, the temperature difference of bonding site decreases, and the temperature distribution uniformity is higher, thus providing a research basis for effectively predicting the temperature distribution and thermal deformation of solid reflectors in orbit.
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